Ngokuphikisana nezidingo eziqinile “ezingenasici” ekukhiqizweni kwe-semiconductor, amagilavu e-Lijie angu-9-intshi aphansi e-chlorine nitrile abe yimishini yokuvikela ebalulekile ezigabeni zokucubungula i-wafer kanye nokupakisha ama-chip ngenxa yezinsalela zawo eziphansi ze-ionic kanye nokusebenza okuphezulu kokuhlanzeka. Ngokusebenzisa izinqubo ezikhethekile, okuqukethwe kwe-chlorine kwegilavu kulawulwa ngokuqinile ku-≤50ppm—okudlula kakhulu izinga lomkhakha elingu-100ppm. Lokhu kuvimbela ngempumelelo izingozi zokugqwala okubangelwa ukufuduka kwe-chloride ion ezindaweni ze-wafer, kuhlangabezana nezidingo eziqinile zokukhiqiza i-semiconductor zokulawula ukungcola okuncane kakhulu.
Ngesikhathi sezinqubo ze-lithography, ukuhlanzeka kwamagilavu kuthinta ngqo ukunemba kokumbozwa kwe-photoresist kanye nemiphumela yokuchayeka. Lo mkhiqizo wenziwe emagumbini okuhlanza ekilasini 100,000 futhi ususwa ngothuli lwe-laser, ubonisa ukukhishwa kwezinhlayiya ezingaphezulu kwezingu-0.2/intshi yesikwele—kuhlangabezana nezindinganiso zegumbi lokuhlanza le-ISO Class 3. Lokhu kuvimbela ngempumelelo ukunamathela kwezinhlayiya ezincane ezindaweni ze-wafer, ngaleyo ndlela kunciphisa amaphutha e-lithography. Umklamo obude obungu-9 intshi unikeza ukumbozwa okugcwele kusukela esihlakaleni kuya entendeni yesandla. Uma uhlanganiswe nesakhiwo se-cuff esinwebekayo, kuqinisekisa ukuguquguquka kokusebenza ngenkathi kuvimbela ngempumelelo ukuchitheka kothuli ekuvulekeni kwesikhafu, kuhlangabezana nezidingo eziqinile zezindawo ezihlanzekile ezinamandla ezinqubweni ze-lithography.
Ngesikhathi sezinqubo ezibandakanya ama-reagent agqwala kakhulu njengokugqwala kanye nokufakelwa kwama-ion, la magilavu abonisa ukumelana kwamakhemikhali okumangalisayo. Ngemva kokuhlolwa kokucwiliswa kwamahora angama-24 kuma-reagent avamile e-semiconductor njenge-hydrofluoric acid kanye ne-phosphoric acid, awabonisi ukuvuvukala noma ukuqhekeka, ngesilinganiso sokushintsha kwesisindo esingaphansi kuka-0.8%. Lokhu kunikeza ukuvikelwa kwesandla okuthembekile kubasebenzi ngenkathi kususwa izingozi zokungcoliswa kwama-reagent okuvela ekulimaleni kwamagilavu. Iminwe inezindwangu ezingashibiliki eziqoshwe nge-laser ezingama-0.02mm, okwandisa ukungqubuzana ngo-35% lapho kuphathwa ama-wafer angu-12 intshi futhi kunciphisa ingozi yokushelela kwe-wafer ngo-60%. Lokhu kufeza ibhalansi phakathi kokuphepha okuvikelayo kanye nokuzinza kokusebenza.
Njengamanje eziqinisekiswe yizindinganiso ze-SEMI F57, la magilavu asetshenziswa emigqeni yokukhiqiza ngobuningi ezindaweni zokukhiqiza ezihamba phambili kufaka phakathi i-SMIC kanye ne-Hua Hong Semiconductor. Anciphisa amazinga e-wafer scrap abangelwa ukuthintana ngesandla ngo-38%, azibeka njengokukhetha okuhle kakhulu ekukhiqizeni ama-semiconductor ukuze kulinganiswe ukuvikelwa kwegumbi lokuhlanza nokusebenza kahle.
Isikhathi sokuthunyelwe: Novemba-11-2025